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 2MBI200UD-120
IGBT Module U-Series
Features
* High speed switching * Voltage drive * Low inductance module structure
1200V / 200A 2 in one-package
Equivalent Circuit Schematic
C1 E2
Applications
* Inverter for Motor drive * AC and DC Servo drive amplifier * Uninterruptible power supply * Industrial machines, such as Welding machines
C2E1 G1 E1 G2 E2
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25C unless otherwise specified)
Item Collector-Emitter voltage Gate-Emitter voltaga Collector current Symbol VCES VGES IC ICp -IC -IC pulse PC Tj Tstg Viso Conditions
Continuous Tc=25C Tc=80C 1ms Tc=25C Tc=80C
Collector Power Dissipation Junction temperature Storage temperature Isolation voltage between terminal and copper base *1 Screw Torque Mounting *2 Terminals *2
1 device
AC:1min.
Rating 1200 20 300 200 600 400 200 400 1040 +150 -40 to +125 2500 3.5 4.5
Unit V V A
W C VAC N*m
*1 : All terminals should be connected together when isolation test will be done. *2 : Recommendable value : Mounting 2.5 to 3.5 N*m(M5 or M6), Terminals 3.5 to 4.5N*m(M6)
Electrical characteristics (at Tj=25C unless otherwise specified)
Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Symbols ICES IGES VGE(th) VCE(sat) (terminal) VCE(sat) (chip) Cies ton tr tr(i) toff tf VF (terminal) VF (chip) trr R lead Conditions VGE=0V, VCE=1200V VCE=0V, VGE=20V VCE=20V, IC=200mA VGE=15V, IC=200A Tj=25C Tj=125C Tj=25C Tj=125C VCE=10V, VGE=0V, f=1MHz VCC=600V IC=200A VGE=15V RG=3 VGE=0V IF=200A Tj=25C Tj=125C Tj=25C Tj=125C Characteristics Min. Typ. - - - - 4.5 6.5 - 1.85 - 2.10 - 1.75 - 2.00 - 22 - 0.36 - 0.21 - 0.03 - 0.37 - 0.07 - 1.70 - 1.80 - 1.60 - 1.70 - - - 0.52 Unit Max. 2.0 400 8.5 2.20 - 2.10 - - 1.20 0.60 - 1.00 0.30 2.00 - 1.90 - 0.35 - mA nA V V
Input capacitance Turn-on time
nF s
Turn-off time Forward on voltage
V
Reverse recovery time Lead resistance, terminal-chip*3
IF=200A
s m
*3:Biggest internal terminal resistance among arm.
Thermal resistance characteristics
Items Thermal resistance Contact Thermal resistance Symbols Rth(j-c) Rth(j-c) Rth(c-f)*4 Conditions IGBT FWD With thermal compound Characteristics Min. Typ. - - - - - 0.025 Unit Max. 0.12 0.20 - C/W C/W C/W
*4 : This is the value which is defined mounting on the additional cooling fin with thermal compound.
2MBI200UD-120
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.) Tj= 25C / chip
500 VGE=20V 15V 12V 400 Collector current : Ic [A] Collector current : Ic [A] 400 500
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.) Tj= 125C / chip
VGE=20V 15V
12V
300 10V
300
200
200
10V
100 8V 0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
100 8V 0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip
500 T j=25C 400 Collector current : Ic [A] T j=125C 10
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25C / chip
Collector - Emitter voltage : VCE [ V ]
8
300
6
200
4
100
2
Ic=400A Ic=200A Ic=100A
0 0 1 2 3 4 5
0 5 10 15 20 25
Collector-Emitter voltage : VCE [V]
Gate - Emitter voltage : VGE [ V ]
Capacitance vs. Collector-Emitter voltage (typ.) VGE=0V, f= 1M Hz, Tj= 25C
100.0 Cies Collector-Emitter voltage : VCE [ 200V/div ] Gate - Emitter voltage : VGE [ 5V/div ]
Dynamic Gate charge (typ.) Vcc=600V, Ic=200A, Tj= 25C
Capacitance : Cies, Coes, Cres [ nF ]
10.0 Cres
VGE
1.0
Coes
VCE 0 300 600 900 1200
0.1 0 10 20 30
Collector-Emitter voltage : VCE [V]
Gate charge : Qg [ nC ]
2MBI200UD-120
Switching time vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=3, Tj= 25C
10000 Switching time : ton, tr, toff, tf [ nsec ] Switching time : ton, tr, toff, tf [ nsec ] 10000
IGBT Module
Switching time vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=3, Tj=125C
1000 ton toff tr 100 tf
1000 toff ton tr 100
tf
10 0 100 200 300 400 Collector current : Ic [ A ]
10 0 100 200 300 400 Collector current : Ic [ A ]
Switching time vs. Gate resistance (typ.) Vcc=600V, Ic=200A, VGE=15V, Tj= 25C
10000 Switching loss : Eon, Eoff, Err [ mJ/pulse ] Switching time : ton, tr, toff, tf [ nsec ] ton toff 1000 40
Switching loss vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=3
Eoff(125C) Eon(125C) 30 Eoff(25C) 20 Eon(25C)
tr 100 tf
10
Err(125C) Err(25C)
10 1.0 10.0 Gate resistance : Rg [ ] 100.0
0 0 100 200 300 400 Collector current : Ic [ A ]
Switching loss vs. Gate resistance (typ.) Vcc=600V, Ic=200A, VGE=15V, Tj= 125C
150 Switching loss : Eon, Eoff, Err [ mJ/pulse ] Eon 500 100 Collector current : Ic [ A ] 400 300 200 100 Err 0 1.0 10.0 Gate resistance : Rg [ ] 100.0 0 600
Reverse bias safe operating area (max.) +VGE=15V,-VGE <= 15V, RG >= 3 ,Tj <= 125C
50
Eoff
0
400
800
1200
Collector - Emitter voltage : VCE [ V ]
2MBI200UD-120
Forward current vs. Forward on voltage (typ.) chip
500 Reverse recovery current : Irr [ A ] Reverse recovery time : trr [ nsec ] Tj=25C Forward current : IF [ A ] 400 1000
IGBT Module
Reverse recovery characteristics (typ.) Vcc=600V, VGE=15V, Rg=3
300
Tj=125C
Irr (125C) Irr (25C) trr (125C) trr (25C) 100
200
100
0 0 1 2 3 4 Forward on voltage : VF [ V ]
10 0 100 200 300 400 Forward current : IF [ A ]
Transient thermal resistance (max.)
1.000 Thermal resistanse : Rth(j-c) [ C/W ]
FWD 0.100 IGBT
0.010
0.001 0.001
0.010
0.100
1.000
Pulse width : Pw [ sec ]
Outline Drawings, mm M233


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